The all new Alpha WS-820 Lead Free Solder Paste
Alpha WS-820 is a brand new solder paste offering the ideal arrangement of printability and reflow profile process window. This innovative product also offers outstanding cleanability in a lead free alloy solder paste. It has excellent print volume and print volume repeatability down to 12 mil, offers excellent wetting characteristics and it has high reflow yield with IPC Class II voiding performance when used to solder BGA components. Alpha WS-820 Solder Paste is able to wet using straight ramp or soak reflow profiles in the air.
Alpha WS-820 Solder Paste Features and Benefits:
- Water based cleaning system
- Exceptional print volume and print volume repeatability down to 12 mil features
- Able to spread and wet using straight ramp or soak reflow profiles in the air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High reflow yield with IPC class II voiding performance when used to solder BGA components
- Outstanding wetting characteristics on all common surface finishes
Alpha WS-820 Solder Paste Products:
Alpha WS-820 SAC305 M18 Cart
Alpha WS-820 Flux 125 GM Jar
Alpha WS 820 Solder Paste Physical Properties:
Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu), SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACX Plus 0807 (98.5%Sn/0.8%Ag/ 0.7%Cu)
Application: Dispense application (84.8% Meal Loading, Type 3 Powder, M7 Viscosity)
Stencil Printing (87.6% Metal Loading, M19 Viscosity)
RoHS Status: Completely free of Hazardous Materials per RoHS Directive 2002/95/EC
Alpha WS-820 Solder Paste Brochures:
Alpha WS-819 WS-820 Solder Pastes Brochure
Alpha WS-820 Technical Data Sheet
Alpha WS-802 Water Soluble, Lead Free Solder Paste Techni
| Printability | Suitable for fine pitch printing applications (Down to 16 mil (0.4mm) pitch QFB components, 12 mil (0.3mm) BGA circles@) up to 100 mm/sec squeegee speed, using 5 mil thick laser cut stencil |
| Appearance (Flux residues after reflowed) | Light yellowing color (before water washed) |
| Metal Content (%) | 88% -0.4% – +0.2% |
| Viscosity (Poise, Malcom spiral viscometer @10rpm) | M19 for stencil printing (1,700 to 2,200 Poise) M7 for dispensing (600 to 800 Poise) |
| Slump Resistance | Pass |
| Random Solder Balls | Preferred (Both Initial and after 4 hours at 25°C and 50% R.H. |
| Response to Pause | 0-1 Knead stroke required |
| Stencil Life (50%+/-15%RH, @25°C) | 5 Hours |
| Tack | Initial 2.0 g/mm²; 1.8 g/mm² after 4 hours 25°C and 50% R.H. |
Alpha WS-820 Solder Paste is well suited for LED applications. This world class lead free, high reliability water soluble paste offers the best in class printing, excellent resistance to BGA voids and cleanability. It is formulated to offer low voiding, ease of cleaning and print volume consistency in conjunction with air flow capability. For more information in regards to this innovative product, Contact Krayden, a authorized distributor of Alpha Solder.
